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MFE Enterprises announces the launch of its new 61 lb. manual and mapping edge scanner today, the MFE Edge. MFE Enterprises applied the superior mapping software and reliable technology of its coveted Mark IV Tank Scanner to the functionality of an edge scanner when designing the MFE Edge.
 
One of the most exciting features of the Edge is its ability to map the critical zone. Mapping an impressive 1/8 inch from the shell wall takes inspectors to unprecedented territory. Operators may utilize the MFE Edge on its own or use it in unison with the Mark IV Tank Scanner. They will have the ability to export their analytical mapping reports from the MFE Edge and import them into the Mark IV Tank Scanner, making the use of both machines a particularly advantageous partnership when mapping defects.
 
MFE Enterprises’ Business Development Manager Bryan Duke says the ability to map the critical zone is an extraordinary advantage for NDT inspectors.
”Mapping the critical zone and getting an 1/8 inch from the shell is a game-changer for our customers. The ability to merge analytical data with the Mark IV will save them so much time, which saves them money. We’re thrilled about this launch and what it will mean for our customers,” Duke says.
 
With other scanners, the time and money constraints of shipping large pieces of equipment to various job sites can be extensive and inconvenient. MFE Enterprises’ answer to this is the Edge’s remarkably light 61 lb. scanner weight. During storage and shipments, the Edge may be separated into two parts: the handle assembly and the magnetic bridge. The two cases distribute the Edge’s already light weight across the two cases, allowing for much easier transport.
 
These features along with the MFE Edge’s 180-degree pivoting handle assembly, Getac Rugged F110 tablet, real-time display, and hot-swappable batteries make the MFE Edge a necessary tool for inspectors.
 
If you want to know more about the MFE Edge or to arrange a demo, please contact Bryan Duke at bduke@mferentals.com.
WALTHAM, Mass., October 30, 2019—OmniScan® instruments are recognized globally as the benchmark for portable phased array ultrasonic testing (PAUT) thanks to their power, reliability and ease of use. The new OmniScan X3 flaw detector elevates the standard with innovations that improve the entire inspection workflow. Setting up for a job is faster and more efficient while total focusing method (TFM) images collected through full matrix capture (FMC) give users more confidence in their decision making. When an inspection is complete, leading-edge software tools make analysis and reporting easier.
The OmniScan X3 flaw detector combines the essential tools needed for PAUT inspections, such as TOFD, two UT channels, eight groups and 16:64PR, 16:128PR and 32:128PR configurations*, with powerful innovations, including:
  • TFM/FMC with 64-element aperture support
  • Improved phased array imaging, including an innovative live TFM envelope feature
  • Acoustic influence map (AIM) simulator for TFM mode
  • 25 GB file size
  • Up to 1,024 × 1,024-pixel TFM reconstruction and four simultaneous, live TFM propagation modes
  • Simplified user interface with onboard scan plan
  • Wireless connectivity to the Olympus Scientific Cloud (OSC) makes it simple to keep the instrument’s software up to date
The comprehensive onboard scan plan tool enables users to visualize the inspection, helping reduce the risk of errors. The entire scan plan, including the TFM zone, can be created in one simple workflow. Creating a setup is also faster with improved calibration tools and support for simultaneous probe and beam set configuration, onboard dual linear, matrix and dual matrix array creation and automatic wedge verification.
Certified IP65 dust proof and water resistant, the instrument has the reliability and ease of use that OmniScan flaw detectors are known for combined with high-quality images that help make interpreting flaws more obvious. With the total focusing method, users can produce geometrically correct images to confirm the characterization of flaws identified through conventional phased array techniques and obtain better images throughout the volume of a part. Additional features that enable outstanding images include a 16-bit A-scan, interpolation and smoothing and a vivid 10.6-inch WXGA display that provides clarity and visibility in any light.
The OmniScan X3 flaw detector makes analysis and reporting faster, both onboard the instrument and on a PC. The instrument also comes with a variety of helpful data interpretation tools:
  • Circumferential outside diameter (COD) TFM image reconstruction to facilitate interpretation and sizing of long seam weld indications
  • Merged B-scan to facilitate the screening of phased array weld indications while keeping the workflow simple
Whether inspecting pipes, welds, pressure vessels or composites, the OmniScan X3 flaw detector enables users to complete their work efficiently and interpret flaws with confidence.
 
For more information about OmniScan flaw detectors, visit: www.olympus-ims.com.
 
*The 16:64PR configuration limits the number of groups to 1 TOFD, 2 PA and 2 TFM.
 
About Olympus
Olympus is a global technology leader, crafting innovative optical and digital solutions in medical technologies; life sciences; industrial solutions; and cameras and audio products. Throughout our nearly 100-year history, Olympus has focused on being true to society and making people’s lives healthier, safer and more fulfilling. 
 
Our Industrial Solutions Business is committed to the safety and betterment of society through the pioneering, development and manufacture of world-leading test and measurement solutions. These solutions are used in industrial and research applications ranging from aerospace, power generation, petrochemical, civil infrastructure, automotive and consumer products. For more information, visit https://www.olympus-ims.com.
 
Olympus…True to You. True to Society. True to LIFE.
 
Hitachi High-Tech Analytical Science in Canada is excited to announce the launch of OE750 – a ground-breaking new optical emission spectrometer for verifying incoming materials specifications in metal processing facilities. Complex supply chains, zero-fault quality strategies and more demanding regulations and standards mean metals processing businesses are under increasing pressure to check their incoming materials beyond grade information and verify tramp and trace elements content before allowing them into production. To meet these new high-demand QAQC requirements, the new OE750 optical emission spectrometer offers a level of analytical performance never previously seen in an analyser in this class. It covers the entire spectrum of elements in metal and has some of the lowest detection limits possible. The result is an analyser that has the capability of much more expensive instruments, bringing high quality analysis within reach for the first time for many metals working businesses.

Revolutionary new optical concepts, with four patents pending, using superior CMOS detector technology is behind the high level of optical resolution and large dynamic range of the OE750. As a result, this new analyser has a very wide wavelength range, meaning it can measure the entire range of elements within metals at low ppm levels. This is essential for meeting today’s tight metals specifications and the analyser can meet the requirements of relevant standards and specifications such as for example the ASTM E415 test method for carbon and low-alloy steel and ASTM E1086 the Standard Test Method for the analysis of Stainless Steel by Spark Atomic Emission Spectrometry.

One advantage of the OE750’s new optics design is the fast start-up time. The instrument is ready for use in less than an hour, thanks to the low volume occupied by the optics. This aids high throughput production, where facilities need to check 100% of the material supplied.
In addition to the new optics design, the OE750 has other technical features that support high volume metals analysis. It has a new sealed spark stand with optimised laminar flow; this reduces argon consumption, reduces the likelihood of contamination and drastically reduces maintenance requirements. A unique mid-pressure system with low-pressure argon purge cuts down the pump usage. This reduces the power consumption of the pump by 90% and enables an oil-free design to be used, increasing reliability and instrument uptime. This makes the OE750 highly reliable with low operating costs.

In addition to innovative hardware technology, the new OE750 includes software that enhances its performance. For example, it includes the Hitachi GRADE Database that includes more than 12 million records for over 339,000 materials from 69 countries and standards, reducing time and potential errors from manually consulting grade catalogues. As an option it comes with a SPC/LIMS package enabling an easy an effective monitoring of processes involved with the instrument and the processes to be controlled with it. This is an ideal tool to meet demands from standards such as IATF 16949.

Wilhelm Sanders, Hitachi OES Product Business Development Manager said: “In the past, metal processing businesses had to choose between high performance analysis and instrumentation that was in their price range. Thanks to the new OE750 they no longer have to make that compromise. The OE750 offers comprehensive metals analysis in one accessible package.”
For more information, contact Non-Destructive Testing (NDT ) Products Limited, the channel partner for Hitachi High-Tech Analytical Science in Canada, at 1-833-202-4504/sales@ndtproducts.ca.

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